{"company":{"name":"Lumentum","slug":"lumentum","website":"https://lumentum.com","category":"networking"},"question":"What has Lumentum shipped recently?","answer":"In the last 30 days, Lumentum shipped 5 tracked updates. The most recent was \"News Details\" on 2026-10-01.","window":{"days":30,"updateCount":5,"returned":5},"generatedAt":"2026-10-08T08:47:20.593Z","updates":[{"title":"News Details","summary":"Lumentum announced its speaker lineup for the 2026 OCP Global Summit, focusing on external laser sources, VCSELs, and optical circuit switching for AI networks. The event, themed 'Scaling Innovation for the AI Era,' runs October 12–15 in San Jose.","date":"2026-10-01","dateIsEstimated":false,"signalType":"event","signalTypeLabel":"Event","sourceUrl":"https://investor.lumentum.com/financial-news-releases/news-details/2026/Lumentum-Announces-Speaker-Lineup-at-2026-OCP-Global-Summit/default.aspx","publisher":"investor.lumentum.com"},{"title":"News Details","summary":"Lumentum, Qualcomm, and Corning will jointly demonstrate a high-density die-to-die (D2D) optical interconnect architecture at ECOC 2026, combining Qualcomm’s D2D interface IP with Lumentum’s 1060 nm VCSEL platform and Corning’s multimode fiber. The solution targets AI scale-up architectures by enabling massively parallel, low-power, low-latency optical links with up to 4 Tb/s/mm shoreline bandwidth density.","date":"2026-09-21","dateIsEstimated":false,"signalType":"integration","signalTypeLabel":"Integration","sourceUrl":"https://investor.lumentum.com/financial-news-releases/news-details/2026/Lumentum-Qualcomm-and-Corning-to-Demonstrate-High-Density-1060-nm-VCSEL-Optical-D2D-Connectivity-for-AI-Scale-Up-at-ECOC-2026/default.aspx","publisher":"investor.lumentum.com"},{"title":"News Details","summary":"Lumentum announced it will demonstrate an eight-wavelength DWDM ELSFP laser module for OCI MSA applications at ECOC 2026, targeting CPO and NPO AI interconnects. The module supports eight simultaneous DWDM wavelengths with ±0.2 nm accuracy and up to 24 dBm output power per wavelength, with initial availability expected in H1 2027.","date":"2026-09-21","dateIsEstimated":false,"signalType":"product_launch","signalTypeLabel":"Launch","sourceUrl":"https://investor.lumentum.com/financial-news-releases/news-details/2026/Lumentum-to-Demonstrate-DWDM-ELSFP-Laser-Module-for-OCI-MSA-Applications-at-ECOC-2026/default.aspx","publisher":"investor.lumentum.com"},{"title":"Moving Gigabytes, Not Gigawatts: The Rise of AI Scale-Across Networking","summary":"Lumentum argues that AI infrastructure must scale across distributed data centers due to power, cooling, and land constraints, introducing the concept of 'scale-across' beyond traditional data center interconnects. The company positions its optical components—including coherent pluggables, MEMS-based circuit switches, and photonic integration—as foundational to enabling high-capacity, flexible, and reliable AI networks.","date":"2026-09-15","dateIsEstimated":false,"signalType":"feature_update","signalTypeLabel":"Feature","sourceUrl":"https://www.lumentum.com/en/blog/moving-gigabytes-not-gigawatts-rise-ai-scale-across-networking","publisher":"lumentum.com"},{"title":"News Details","summary":"Lumentum announced its speaker lineup for ECOC 2026 in Málaga, Spain, where its experts will discuss innovations in AI interconnects, silicon photonics, VCSELs, and optical networking. The event runs from September 20–24, 2026.","date":"2026-09-15","dateIsEstimated":false,"signalType":"event","signalTypeLabel":"Event","sourceUrl":"https://investor.lumentum.com/financial-news-releases/news-details/2026/Lumentum-Experts-to-Share-Insights-at-ECOC-2026/default.aspx","publisher":"investor.lumentum.com"}],"attribution":{"source":"Spyingbee","url":"https://spyingbee.com/updates/lumentum","citation":"Spyingbee, \"Lumentum updates\", https://spyingbee.com/updates/lumentum (retrieved 2026-10-08)"}}